Tantalum coated target material

Shaanxi Zhongheng Weichuang Metal Materials Co., Ltd. is located in the High tech Development Zone of Baoji City, Shaanxi Province. Our main products include plates, rods, tubes, wires, particles, foils and other conventional processed profiles of tantalum, niobium, titanium, nickel, zirconium, hafnium and their alloys, as well as deep processed products such as crucibles, grounding rings, protective tubes, target materials, screws, etc. Integrated factory and trade, customizable, standard products available, 24-hour after-sales service.

 

 

Features and Applications

01.

The characteristics of tantalum coated target materials are as follows

High purity: The purity of tantalum target material usually reaches above 99.9995%, ensuring the high quality and stability of the coating.

Good conductivity: Tantalum is an excellent conductive material suitable for applications that require good electrical performance.

Corrosion resistance: Tantalum performs well in many chemical environments and is suitable for applications that require corrosion resistance.

Precision dimension control: The 80x2 specification requires strict thickness tolerance and surface flatness to avoid uneven coating or particle splashing during the sputtering process.

02.

Preparation process and market application

Semiconductor manufacturing: used for thin film deposition in chip manufacturing to improve device performance and reliability.

Optical components: used to manufacture optical lenses and windows, improving optical performance and durability.

Magnetic storage media: used for manufacturing magnetic storage devices to improve data storage density and stability.

Wear resistant and corrosion-resistant devices: used to manufacture various corrosion-resistant and wear-resistant industrial components, extending their service life.

Production process of tantalum coating target material
Raw material purification and powder preparation
1. Ore smelting: Separate tantalum element from tantalum ore (such as tantalite) through pyrometallurgy or hydrometallurgy, and then obtain high-purity tantalum metal (purity ≥ 99.95%) through electrolytic refining.
Powder preparation: Micro sized tantalum powder (particle size 2-3 μ m) is produced using sodium thermal reduction method, and the particle size distribution is controlled by sieving.
2. Molding process
Cold isostatic pressing: Place tantalum powder into a latex jacket and maintain pressure for at least 20 minutes in a high-pressure environment above 200MPa to form a preliminary body .
Advantages: High pressure compresses the powder evenly, reduces internal pores, and improves the density and structural uniformity of the body.
3. High temperature sintering
Vacuum sintering: The billet is placed in a vacuum furnace (vacuum degree ≥ 10 ⁻ ² Pa) and sintered at a high temperature above 2400 ℃ for ≥ 1.5 hours.
Key function: Eliminate powder gaps, promote grain bonding, and significantly improve density (up to 94% or more).
4. Plastic processing and heat treatment
Rolling deformation: The sintered billet is rolled multiple times (with a deformation of about 20% per pass), and the heating temperature is gradually reduced (by 100 ℃ per pass) to refine the grain size and improve mechanical properties.
Heat treatment: Annealing in a vacuum environment to release processing stress and optimize the uniformity of the target material structure.
5. Precision machining and testing
Machining: Processing the blank to the target size (such as round target, square target) through processes such as turning and milling.
Quality inspection: Verify density (≥ 16.68 g/cm ³), purity (≥ 99.95%), grain size, and defects to ensure compliance with sputtering requirements.

The global tantalum target material market is steadily growing, especially in the high-end field, where Japanese and American companies have a clear advantage. With the continuous advancement of technology and the expansion of applications, the market demand for tantalum coated target materials will continue to increase, especially in the fields of semiconductors and optics, with broad application prospects.

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